{"id":3117,"date":"2024-01-25T09:34:00","date_gmt":"2024-01-25T07:34:00","guid":{"rendered":"https:\/\/x-ifu.irap.omp.eu\/?p=3117"},"modified":"2024-02-20T10:09:26","modified_gmt":"2024-02-20T08:09:26","slug":"dre-demux-demonstrator-model-pcb-irap","status":"publish","type":"post","link":"https:\/\/x-ifu.irap.omp.eu\/en\/science\/dre-demux-demonstrator-model-pcb-irap","title":{"rendered":"Delivery of the DRE DEMUX Demonstrator Model PCB at IRAP"},"content":{"rendered":"<p>The <strong>DRE De-multiplexing (DEMUX) Demonstrator Model (DM) printed circuit board (PCB) arrived at IRAP<\/strong> on <strong>January 15<\/strong>. It was designed by the DRE team at IRAP, with CAO-concept handling the layout and CIBEL the manufacturing. The soldering of the components on the board is ongoing.<\/p>\n<p>It consists of a 16-layer rigid and a 4-layer flexible PCB measuring 177 mm x 300 mm. To comply with European Cooperation for Space Standardization (ECSS) design rules, signals are routed through the PCB&#8217;s inner layers. Of the 16 layers of the rigid part, only 6 are available for signal routing.<\/p>\n<p>The others are used for ground, power supplies and shielding to ensure a good impedance control of all tracks, thus improving signal integrity. To minimize crosstalk between the detection chains, the PCB is mounted on an aluminum frame, which acts both as a stiffener for the PCB and as an EMC shield between the various sensitive functions. The PCB has been gold-plated at its interface with the stiffener to ensure good electrical and thermal conduction (see photo).<\/p>\n<p>In the DEMUX Demonstrator Model, digital processing is carried out by a new-generation Field-programmable gate array (FPGA): the NanoXplore NG Large. The PCB&#8217;s track density is very high. This is particularly true in the FPGA area, which is housed in a 1752-column case with a 1mm pitch. For maximum efficiency, the FPGA power supplies are decoupled directly at the rear of the FPGA.<\/p>\n<p>We will now send the PCB to Matra Electronique, who will solder the components. Testing of the board should begin at the end of March at IRAP.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>The DRE De-multiplexing (DEMUX) Demonstrator Model (DM) printed circuit board (PCB) arrived at IRAP on January 15. It was designed by the DRE team at IRAP, with CAO-concept handling the layout and CIBEL the manufacturing.\u00a0<\/p>\n","protected":false},"author":5,"featured_media":3105,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"inline_featured_image":false,"footnotes":""},"categories":[10],"tags":[15,144,143,145,12,147,146,13],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v21.6 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>Delivery of the DRE DEMUX Demonstrator Model PCB at IRAP - Athena X-IFU<\/title>\n<meta name=\"description\" content=\"The DRE De-multiplexing (DEMUX) Demonstrator Model (DM) printed circuit board (PCB) arrived at IRAP on January 15.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/x-ifu.irap.omp.eu\/en\/science\/dre-demux-demonstrator-model-pcb-irap\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Delivery of the DRE DEMUX Demonstrator Model PCB at IRAP - 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